Products
ALD
It can be considered as a special type of chemical vapor deposition. The majority of ALD reactions use two or more chemicals called precursors.
Thermal ALD
In most ALD reactions, two chemicals are used as precursors. These precursors react with the material surface in a continuous and self-limiting manner.
Plasma ALD
This process allows fabricating the conformal thin films of various materials with atomic-scale control without high temperature required to deliver the necessary activation energy.
Plasma Etching
Dry etching is known as plasma dry etching is the process of removing materials from the surface of another material.
RIE
The RIE process is a chemical physical etching process, and is the most important process for constructing various films in semiconductor manufacturing.
ICP-RIE
The high density plasma is created, surrounded by the coil, and act as the secondary coil in a transformer, accelerating the electrons and ions, and thus causing collisions that produce even more ions and electrons.
ALE
As the functional size of the device is further reduced, further use of ALE is required to achieve its required accuracy.
Cluster tool
The Multi-Chamber cluster coating system is a cluster of vacuum chamber systems interconnected through the transfer chamber which placed in center of cluster system.
Annealing Furnace
The annealing furnace is a process method used in the fabrication of semiconductors. This process includes heating a plurality of semiconductor wafers to affect their electrical properties.