Plasma enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition (CVD) technology using a plasma to provide some of the energy for the deposition reaction to take place. PECVD alternate for depositing a variety of thin films at lower temperatures than conventional CVD methods without losing film quality.

PECVD is more widely used than other CVD technologies in semiconductor industry. PECVD can deposit thin film at low operating temperature (less than 350°C) with uniform coating of different shapes, good step coverage, high packing. For SYSKEY's system can control the gas and real time record system data (pressure, substrate temperature), can perfectly produce high-quality thin films.

　　　　　　　PECVD and PEALD　　　　　　　　　　　　　　PECVD and RIE

　　We also develop different machines but share
　　　　components to achieve cost down.