Sputtering deposition is a PVD method in which a thin film is formed by sputtering a material from a target and then depositing it on a substrate.

Co-sputtering is simultaneous coating from two or multiple sputtering targets. It is used for compound - alloy or composite material.

For UHV environment, it is very important to scientific research, because experiments often require surfaces to be maintained in a contamination-free state for the duration of the process.

The high-quality multilayer films are becoming increasingly important in precision systems that single material thin film cannot practice the required specifications.

In-Line Sputtering Deposition System is that substrates passed linearly beneath one or more sputter cathodes to acquire their thin film coating.

It has 4 independent sputtering chambers, allowing customers to arbitrarily match the deposited materials, while maintaining a quick and low-cost system.

The materials are placed in a resistive heat source in vacuum environment to evaporate directly to the substrate, where they condense back to a solid state form a thin film.

The evaporation source using electric heating can be used to deposit most organic and inorganic thin films, among which the resistance Joule method is the most common.

This process requires high precision and uniformity of thin films by accurately controlling temperature and deposition rate.