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FPD-PVD

OLEDs / Display

OPV / Perovskite Solar-Cell

Semiconductors

Physical / Material research

With the increase in size of LCD panels and glass need of manufacturing, manufacturing equipment has also become larger, requiring ever-larger equipment investments. SYSKEY develops a system of PVD equipment for small and medium size needs. It has 4 independent sputtering chambers, allowing customers to arbitrarily match the deposited materials, while maintaining a quick and low-cost system.



 

 

Applications  
  • TFT-LCD.
  • Solar-cell.
  • Touch panel.
  • Oxide, nitride and metal materials research.
  
Configurations and benefits Options
  • Flexible substrate size up to 550 x 650 mm2 (glass).
  • Excellent thin-film uniformity of less than ±5%.
  • Substrate heating up to 400°C with stable temperature control.
  • Cassette port.
  • Substrate plasma cleaning.
  • Extra spare port for OES, RGA or extra process monitoring.

 

application field

Related Products

Magnetron Sputter

Sputtering deposition is a PVD method in which a thin film is formed by sputtering a material from a target and then depositing it on a substrate.

Co-Sputter

Co-sputtering is simultaneous coating from two or multiple sputtering targets. It is used for compound - alloy or composite material.

UHV Sputter

For UHV environment, it is very important to scientific research, because experiments often require surfaces to be maintained in a contamination-free state for the duration of the process.

Multi-Layer Sputter

The high-quality multilayer films are becoming increasingly important in precision systems that single material thin film cannot practice the required specifications.

In-Line Sputter

In-Line Sputtering Deposition System is that substrates passed linearly beneath one or more sputter cathodes to acquire their thin film coating.

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