Microwave plasma cleaning technology has many advantages, such as no-damage, high efficiency, and no electrode sputter pollution. It can thoroughly clean and treat contaminants on the surface of materials, and is especially suitable for packaging cleaning of sensitive chips.

The SYSKEY plasma system is specifically designed for the ashing and cleaning of semiconductor wafers. It achieves this by generating monatomic oxygen (reactive species), which chemically reacts with the photoresist on the wafer surface.

In a manual loading system, the chamber has a pull-out door, and the wafer is placed on a surface mounted on the door, with heating or cooling functions inside the chamber. In a fully automated system, the wafer is loaded into the chamber through dynamic alignment using a robotic system.